Memory

When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving the spec open to further expansions with faster memory as technology progressed. Now, a bit more than three-and-a-half years later, and the standards body and its members are gearing up to release a faster generation of DDR5 memory, which is being laid out in the newly updated JESD79-JC5 specification. The latest iteration of the DDR5 spec defines official DDR timing specifications up to 8800 MT/s, as well as adding some new features when it comes to security. Diving in, the new specification outlines settings for memory chips (on all types of memory modules) with data transfer...

SK Hynix and TSMC Team Up for HBM4 Development

SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...

5 by Anton Shilov 4 days ago

Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet

Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...

6 by Anton Shilov 6 days ago

Corsair Enters Workstation Memory Market with WS Series XMP/EXPO DDR5 RDIMMs

Corsair has introduced a family of registered memory modules with ECC that are designed for AMD's Ryzen Threadripper 7000 and Intel's Xeon W-2400/3400-series processors. The new Corsair WS DDR5...

9 by Anton Shilov on 4/12/2024

Report: Impact of Taiwanese Earthquake on DRAM Output to be Negligible in Q2

Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even...

2 by Anton Shilov on 4/10/2024

Samsung Unveils CXL Memory Module Box: Up to 16 TB at 60 GB/s

Composable disaggregated data center infrastructure promises to change the way data centers for modern workloads are built. However, to fully realize the potential of new technologies, such as CXL...

17 by Anton Shilov on 4/3/2024

Introspect Intros GDDR7 Test System For Fast GDDR7 GPU Design Bring Up

Introspect this week introduced its M5512 GDDR7 memory test system, which is designed for testing GDDR7 memory controllers, physical interface, and GDDR7 SGRAM chips. The tool will enable memory...

0 by Anton Shilov on 3/29/2024

HBM Revenue Poised To Cross $10B as SK hynix Predicts First Double-Digit Revenue Share

Offering some rare insight into the scale of HBM memory sales – and on its growth in the face of unprecedented demand from AI accelerator vendors – the company...

6 by Anton Shilov on 3/28/2024

GDDR7 Approaches: Samsung Lists GDDR7 Memory Chips on Its Product Catalog

Now that JEDEC has published specification of GDDR7 memory, memory manufacturers are beginning to announce their initial products. The first out of the gate for this generation is Samsung...

16 by Anton Shilov on 3/27/2024

Report: SK Hynix Mulls Building $4 Billion Advanced Packaging Facility in Indiana

SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. If the company proceeds with the plan, it intends to invest...

4 by Anton Shilov on 3/26/2024

Construction of $106B SK hynix Mega Fab Site Moving Along, But At Slower Pace

When a major industry slowdown occurs, big companies tend to slowdown their mid-term and long-term capacity related investments. This is exactly what happened to SK hynix's Yongin Semiconductor Cluster...

8 by Anton Shilov on 3/23/2024

Micron Samples 256 GB DDR5-8800 MCR DIMMs: Massive Modules for Massive Servers

Micron this week announced that it had begun sampling of its 256 GB multiplexer combined (MCR) DIMMs, the company's highest-capacity memory modules to date. These brand-new DDR5-based MCRDIMMs are...

4 by Anton Shilov on 3/22/2024

Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025

Being the first company to ship HBM3E memory has its perks for Micron, as the company has revealed that is has managed to sell out the entire supply of...

27 by Anton Shilov on 3/22/2024

SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s

SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the...

3 by Anton Shilov on 3/19/2024

Asus Adds Support for 64GB Memory Modules to Intel 600/700 Motherboards

Asus on Thursday said it has released new versions of UEFI BIOS for DDR5-supporting Intel 600/700-series motherboards that enable support for 64 GB DIMMs. As a result, Asus's latest...

4 by Anton Shilov on 3/14/2024

V-Color Has New RDIMM Octo-Kits For Threadripper 7000 CPUs: 768 GB Kits Starting at $4,840

V-Color has launched several EXPO-certified DDR5 RDIMM memory kits for AMD's Ryzen Threadripper 7000 Pro and non-Pro platforms. The new RDIMM memory kits, which only come in an eight-DIMM...

2 by Zhiye Liu on 3/7/2024

JEDEC Publishes GDDR7 Memory Spec: Next-Gen Graphics Memory Adds Faster PAM3 Signaling & On-Die ECC

JEDEC on Tuesday published the official specifications for GDDR7 DRAM, the latest iteration of the long-standing memory standard for graphics cards and other GPU-powered devices. The newest generation of...

10 by Ryan Smith & Anton Shilov on 3/6/2024

SK Hynix Mulls 'Differentiated' HBM Memory Amid AI Frenzy

SK Hynix and AMD were at the forefront of the memory industry with the first generation of high bandwidth memory (HBM) back in 2013 – 2015, and SK Hynix...

10 by Anton Shilov on 3/1/2024

Samsung Launches 12-Hi 36GB HBM3E Memory Stacks with 10 GT/s Speed

Samsung announced late on Monday the completion of the development of its 12-Hi 36 GB HBM3E memory stacks, just hours after Micron said it had kicked off mass production...

4 by Anton Shilov on 2/27/2024

Micron Kicks Off Production of HBM3E Memory

Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company's HBM3E known good stack dies (KGSDs) will be used for Nvidia's H200...

8 by Anton Shilov on 2/26/2024

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